Dispensing methods


Potting under atmosphere

Potting under atmosphere

One area of application for dispensing technology is casting under atmosphere, the aim of which is to increase the service life of the treated products.

In this process, components are filled or cast with a low-viscosity casting material (PU, epoxy, silicone) so that they are protected from external influences.

When casting under atmosphere, the reaction casting resin is filled directly into the product or into a usually open mould through a dispensing head. The resin must then cure, usually at low temperatures. In this way, cable bushings, sensors or electronic components, for example, can be optimally protected.



Vacuum potting

Vacuum potting

By using vacuum potting, components can be optimally protected against external influences, as air and moisture are extracted from the material by the vacuum. Applications of this dispensing technology are sometimes cable bushings, sensors and electronic components.

The use of vacuum potting guarantees an even distribution of the resin. During the process, the pressure on the material is evenly distributed over the entire surface, minimizing the risk of damage and breakage. This dispensing technology guarantees high process reliability and efficiency.

Application of thermal conductive pastes

Gap Filler dispensing application in battery packs

Dispensing application of liquid thermal interface materials for an effective heat dissipation and thermal management in electronic devices like  

  • Heat sinks
  • PCBs
  • Battery systems in H/EV (hybrid and electric) vehicles
  • Engine manufacturing
  • Power electronics
  • Household appliances
  • Entertainment and consumer electronics (Smartphones and tablets)

Video of a thermally conductive Gap Filler DowSilTM TC 4525 A/B

Video of a thermally conductive Gap Filler dispensing application with Wacker Semicosil 963 TC A/B

Download product information high-volume dispensing technology for EV & HEV

Sealing with Encapsulation Equipment

Sealing with Encapsulation Equipment

Sealing is an effective method of protecting components from external influences by means of a barrier. This method is also used to connect different components with each other.

Highly viscous sealants are applied to the components according to a defined casting contour. This process protects sensitive components from dust, temperature-related influences, moisture and other factors. Areas of application for this dispensing technology are the sealing of housings and housing covers.

In order to achieve optimum protection of the components, a continuously precise application is indispensable. Depending on the area of application and requirements, different modules can be used, which allows this dosing technology to be used flexibly.


Magnet bonding application

Bonding is the process of joining two or more parts together. In contrast to welding, an effective gluing process allows a connection to be made without causing damage to the components.

Especially in recent years, bonding has become more and more established as an application area for dispensing technology. During application, both the surface and the material remain unchanged. Bonding therefore does not influence factors of the component such as mechanics, aerodynamics or aesthetics.

As a rule, the process consists of two steps: First, the adhesive is applied and then the parts are joined together. During this process, the adhesive is applied to previously defined areas on the outside or inside of the component.

This process is frequently used in the automotive sector in particular, for example to bond door handles or truck loading bay lights.