bdtronic

Company Events

Events

Fair

Bondexpo
Date: 05.10.2020 - 08.10.2020
Organizer: P. E. Schall GmbH & Co. KG
Event location: Stuttgart, Germany

Visit us at the Bondexpo- the  international trade fair for bonding technology. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

The mechanical engineering company bdtronic informs you about innovations in the field of dispensing and metering of single and multi-component materials, micro dispensing, impregnation technology for electric and hybrid motors, hot riveting of plastics and plasma pretreatment for better adhesion on surfaces before gluing or bonding.

Ask for your entry ticket today.

Go to the Bondexpo website

http://www.bondexpo-messe.de/

 

 

 

 


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Information to our events

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Direct contact

Contact us
T  +49 7934 104 - 0
veranstaltung@bdtronic.de