Sealing is an effective dispensing method for protecting components from external influences by means of a barrier. A usually highly viscous sealing material is applied to the components according to a specified two-dimensional or three-dimensional sealing contour. The most common applications here are the sealing of housings and housing covers. In addition, this method is used to join components together. It is used to eliminate dust, temperature-related influences, moisture, protection of sensitive components and other external influences. In order to achieve the optimum sealing contour, a continuous, precise dispensing application is essential. The dispensing technology of bdtronic is flexibly designed for the respective required application and the dispensing material.
CIPG (Cured In Place Gasket) or FIPG (Formed In Place Gasket)
The CIPG (Cured In Place Gasket) or FIPG (Formed In Place Gasket) dispensing processes are typically used. In CIPG, liquid gaskets are applied to a housing and then the lid is joined. This process is a soluble joint and allows the lid to be opened for component repair purposes. FIPG is a non-detachable connection that adheres to both the housing and the lid.