Material preparation for highly viscous to pasty materials

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Dispensing machines

Material preparation for highly viscous to pasty materials

Gentle to material and clean

Material preparation is carried out by removing material from original containers, whereby the sizes of the containers can vary. The container change is clean and uncomplicated, so that hardly any downtimes occur. Optimum residual emptying of the container minimizes material loss. The bdtronic technology offers conveying of the material with lowest conveying pressure. Sedimentation due to e.g. a high conveying pressure is completely prevented.

Moisture-curing adhesives are conveyed through a vacuum chamber. Vacuum degassing with an integrated vacuum control perfectly prepares the potting medium for bubble-free dispensing without residual moisture. Furthermore, variable follower plate sizes are available for a wide range of potting diameters.

PPS

Material preparation for highly viscous to pasty, high-filler and abrasive dispensing materials

Product flyer

Characteristics

Frame incl. sheet metal enclosure and integrated control cabinet

Separate emergency stop circuit, signal status light 

Conveyor unit

Feed pump design screw pump

Extendable receiving plate for containers

Variable follower plate sizes for a wide range of bundle diameters

Advantages

Gentle on materials thanks to low working pressures 

Analog level monitoring

Low space requirement 

Clean and uncomplicated container exchange

Optimal residual emptying

Technical data PPS

Dimensions (WxHxD) 1K PPS 670 mm 1.700 mm 680 mm
Dimensions (WxHxD) 2K PPS 1.340 mm 1.700 mm 680 mm
Floor space < 0,45 m² (1K) < 0,9 m² (2K)
Weight 450 kg (1K) 880 kg (2K)
Electrical power supply 400 V / 50 Hz 16 A fuse protection
Pneumatic supply max. 6 bar

DPS

Material preparation for highly viscous to pasty, high-filler and abrasive dispensing materials from large containers

Product flyer

Characteristics

Frame incl. sheet metal enclosure and integrated control cabinet

Separate emergency stop circuit, signal status light

Conveyor unit

Feed pump design screw pump

Extendable receiving plate for containers

Advantages

Variable follower plate sizes for a wide range of bundle diameters

Gentle on materials thanks to low working pressures 

Minimization of downtimes through use of large containers

Clean and uncomplicated container exchange

Optimal residual emptying

Technical Data DPS

Dimensions (WxHxD) 1K DPS 1.300 mm 2.100 mm 1.100 mm
Dimensions (WxHxD) 2K DPS 2.600 mm 2.100 mm 1.100 mm
Footprint 1K DPS < 1,45 m² (1K) < 2,9 m² (2K)
Weight approx. 800 kg (1K DPS) approx. 1,600 kg (2K DPS)
Electrical power supply 400 V / 50 Hz 32 A fuse protection
Pneumatic supply max. 6 bar

CPS

Material preparation for highly viscous to pasty, high-filler and abrasive dispensing materials from cartridges

Characteristics

Frame incl. sheet metal enclosure and integrated control cabinet

Separate emergency stop circuit, signal status light

Conveyor unit

Feed pump design screw pump

Analog level monitoring

Advantages

Gentle on materials thanks to low working pressures

Low space requirement

Clean and uncomplicated container exchange

Optimal residual emptying

Technical Data CPS

Dimensions (WxHxD) 1K CPS 670 mm 1.700 mm 680 mm
Dimensions (WxHxD) 2K PPS 1.340 mm 1.700 mm 680 mm
Floor space < 0,45 m² (1K) < 0,9 m² (2K)
Weight 450 kg (1K) 880 kg (2K)
Electrical power supply 400 V / 50 Hz 16 A fuse protection
Pneumatic supply max 6 bar

Configuration and expansion options

Configurations

1K or 2K Material preparation

Slave variant for bdtronic dispensing machines

In-house process control

Use as integratable dispensing system

Variable diameter of the follower plates 

Suitable for different container heights

DPS vacuum follower plate for bubble-free container changeover

DPS: Fold-out pick-up plate for containers

Membrane drying unit

Barcode scanner for scanning ID material container

Database connection MDE / BDE

ESD equipment

Dispensing heads

1K dispensing structure

1K dispensing assembly mini-dis (microdispensing)

2K dispensing assembly static for liquid dispensing materials

2K dispensing assembly mini-dis (microdispensing)

2K dispensing structure dynamic

Multi-head applications

Application areas

The dispensing process bonding joins two or more joining partners together.

The dispensing process Sealing is an effective method of protecting components from external influences by creating a barrier.

The application of thermally conductive pastes is used to dissipate heat in order to protect power electronics from reduced performance or defects caused by overheating.