Telecommunication & Digitalization

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Process solutions for the digital age

Telecommunication & Digitalization

Technology solutions for the digital age

Telecommunications is the exchange of data using electronics and electrical engineering. Wherever electronic components are located, our process technologies dispensing, plasma pretreatment and joining with heat staking are used. The electronic components and electronic parts must be efficiently protected against any external and damaging effects such as dirt, moisture and extreme temperature fluctuations.  

Our dispensing systems can be used for various dispensing applications such as potting or dispensing thermally conductive materials on electronic components. The use of our plasma systems optimally prepares component surfaces for a subsequent dispensing process such as bonding. This ensures long-term adhesion. The heat staking joining technology is used to join all thermoplastics or thermoplastic materials with other materials such as metals. This makes screws unnecessary and is gentle on components. 

Telecommunication & Digitization

Innovative process solutions

bdtronic offers a comprehensive process portfolio consisting of dispensing technology, plasma pretreatment and heat staking for customer-oriented solutions along the entire value chain in the telecommunications industry. Together with our customers and our international material partners, we jointly develop the optimal technology solution.

Technology solutions for telecommunications and digitization

The rollout of 5G networks is progressing in leaps and bounds. Higher frequencies and the associated increased signal loss require a densification of network installations. As a result, significantly more small (pico or femto) stations are being used. Optimal thermal management solutions are just as important here as the protection of sensitive electronics.

Dispensing

5G Base stations

A thermal paste is dispensed into the casing for optimal heat management. A liquid seal is applied to the case to prevent moisture from entering the interior.

Plasma

Base stations for LTE networks

Plasma pretreatment is used to achieve better adhesion of the adhesive to the housing.

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Sales worldwide

Latest press releases

bdtronic wins Global Awards at CWIEME 2022

bdtronic awarded in the categories "Engineer of the year" and "Excellence Award"

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Framework agreement for heat staking technology

bdtronic delivers 15 fully automatic heat staking lines for the production of driver assistance systems to a leading international automotive supplier.

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Sales & service office in Bangalore, India

bdtronic strengthens its presence in India and opens a sales & service office in Bangalore.

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Events

Date: 28.06.2022
Stuttgart, Germany
Expo

Electric & Hybrid Vehicle Technology Expo Europe

At the Electric & Hybrid Vehicle Technology Expo Europe, we will present our technology solutions for vehicle electrification and electromobility. Meet us in Stuttgart on 28 - 30 June, 2022.
Date: 28.06.2022
Michigan, USA
Expo

Adhesives & Bonding Expo

At the Adhesives & Bonding Expo, we will showcase our dispensing and plasma technology for high-performance bonding results and surface treatment. Visit us at our booth from June 28-30, 2022 in Novi, Michigan.
Date: 13.07.2022
Shanghai, China
Expo

Productronica China 2022

bdtronic presents the latest developments in the fields of dispensing and plasma treatment, impregnation and powder coating at the Productronica in Shanghai. Visit us from July 13 - 15, 2022.