Telecommunication & Digitalization

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Process solutions for the digital age

Telecommunication & Digitalization

Technology solutions for the digital age

Telecommunications is the exchange of data using electronics and electrical engineering. Wherever electronic components are located, our process technologies dispensing, plasma pretreatment and joining with heat staking are used. The electronic components and electronic parts must be efficiently protected against any external and damaging effects such as dirt, moisture and extreme temperature fluctuations.  

Our dispensing systems can be used for various dispensing applications such as potting or dispensing thermally conductive materials on electronic components. The use of our plasma systems optimally prepares component surfaces for a subsequent dispensing process such as bonding. This ensures long-term adhesion. The heat staking joining technology is used to join all thermoplastics or thermoplastic materials with other materials such as metals. This makes screws unnecessary and is gentle on components. 

Telecommunication & Digitization

Innovative process solutions

bdtronic offers a comprehensive process portfolio consisting of dispensing technology, plasma pretreatment and heat staking for customer-oriented solutions along the entire value chain in the telecommunications industry. Together with our customers and our international material partners, we jointly develop the optimal technology solution.

Technology solutions for telecommunications and digitization

The rollout of 5G networks is progressing in leaps and bounds. Higher frequencies and the associated increased signal loss require a densification of network installations. As a result, significantly more small (pico or femto) stations are being used. Optimal thermal management solutions are just as important here as the protection of sensitive electronics.

Dispensing

5G Base stations

A thermal paste is dispensed into the casing for optimal heat management. A liquid seal is applied to the case to prevent moisture from entering the interior.

Plasma

Base stations for LTE networks

Plasma pretreatment is used to achieve better adhesion of the adhesive to the housing.

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Sales worldwide

Latest press releases

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Multi million euro e-mobility project for bdtronic

Trickling of hairpin stators for one of the leading TIER1-suppliers worldwide

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Events

Date: 13.07.2021
Novi, Michigan - USA
Exhibition

Adhesives & Bonding Expo

13th-15th of July 2022, the adhesive & bonding in Novi, Michigan - USA, will take place. Don´t miss us there.
Date: 20.04.2021
Online
Webinar

On-Demand Webinar @ Charged Virtual Conference

We will inform about the advantages of trickle impregnation compared to other technologies and show how it can be combined in-line with a powder coating process for the protection of hairpin welding points in a cost-effective way and dispensing processes commonly used in manufacturing of battery storage systems and power electronics.
Date: 24.03.2021
Online
Webinar

On-Demand Webinar @ CWIEME

Don't miss this opportunity and get a sneak peek into the world’s fastest and biggest impregnation plant, built in series for the premium electric car platform of a renowned German OEM.