Low pressure plasma

For the entire low pressure plasma surface treatment of structured components and cavities or bulk goods.

  • Cold plasma process
  • Optional process gas and process mixing
  • Suitable for electronics
  • Particle-free application
  • Long time stable effects
  • Cycle times depending on chamber volume and pump
  • Chamber volume and pump variation upon request
  • Typical cycle times 20 s to 2 min
  • Typical operating pressure 0,4 - 1,0 mbar

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