Due to the use of power electronics in a very confined space, it is necessary to dissipate the heat generated effectively and reliably. This minimizes the risk of defects, overheating or reduced performance of electronic devices. To enable this dissipation, thermally conductive materials are used, which are bonded directly to the power electronics. The quality of the product is increased and a possible maintenance effort is significantly reduced.
Compared to solid thermally conductive pads or films, this dispensing process offers the advantage that the thermally conductive pastes adapt optimally to the individual contours of the component. Air gaps are prevented and thermal conductivity is increased. Thermally conductive pastes are highly filled, and because of the thermal conductivity, it is necessary to use abrasive fillers. This requires low-wear dispensing systems through which a permanently precise dispensing application can take place. The material must be conveyed with as little pressure as possible so that segregation of the thermally conductive paste is prevented.
Applications for this dispensing process include heat sinks, printed circuit boards and electronic components, as well as battery systems in hybrid cars and electric vehicles.
