Potting and vacuum potting

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Dispensing methods

Potting and vacuum potting

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The potting of components is chosen to protect sensitive components, eliminate dust, temperature-related influences, moisture or increase service life. The encapsulation of electronics is also one of the applications of this dispensing process. Components are filled or poured with low-viscosity potting materials such as polyurethanes (PU), epoxy resins (epoxy), silicones.

The material preparation should be selected ideally for the potting medium and according to the application. The reaction casting resin is filled directly into the product through a dispensing head (1K, static, dynamic). Subsequently, curing takes place via time, temperature, UV or humidity.

Typical applications are pacemakers, cable bushings, sensors or electronic components.

During potting, components are filled with a low-viscosity potting material to protect them from external influences.

Vacuum potting

By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries that are difficult to vent, coils, transformers or wound goods can be potting free of air bubbles. Potting under vacuum guarantees an even distribution of the potting material.

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Benefit from our expertise and many years of experience. Develop the optimum process for your requirements together with us. We are specialists for different applications and processes.